Published on
August 4, 2025
- 15:00 GMT
Domestic AI Chip Breakthrough: Chinese TC Bonder Completes First-Ever CoWoS Packaging Test
NEW YORK, UNITED STATES, August 4, 2025 /EINPresswire.com/ -- DeepSeek's rapid progress appears to have narrowed China's AI gap with the US, yet domestic large models still rely on Nvidia chips heavily. While China’s GPU design capabilities …
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Electronics Industry, IT Industry
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